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Nanofabrication

COMPETENCE UNITS

Nanophotonics
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DESCRIPTION

The INL cleanroom facility offers micro- and nanofabrication solutions on substrates from 200-mm-diameter wafers down to samples below 10 mm in size, to both internal and external users, some of which are performed in multi-project wafer (MPW) formats.

This open-access user facility provides support throughout all the development chain in cleanroom processes: device modeling and design, process integration and device fabrication, packaging and testing.

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Some outstanding aspects include:

• A considerable effort is dedicated to user training through summer internships, exchange and doctoral programs and RTD agreements with industrial partners
• It not only allows access to its infrastructure and systems but also to microsystems and nanotechnology expert support with considerable flexibility
• A heterogeneous set of techniques is available under the same roof leading to competitive integration of different technologies and rapid prototyping thus paving the way to methods and devices with performances out of reach of a given, single technology.
• State-of-the-art processes are developed using industrial and semi-industrial systems on 200-mm-diameter substrates (standard size of most semiconductor, sensors and MEMS companies), making INL a very attractive ally to applied research laboratories, start-ups, SME-s and even large companies to develop their own processes and consequent technology transfer.

Available technologies include:

• Advanced Si micromachining

• MEMS and NEMS

• Processes for spintronics, sensors and hybrid devices, microfluidics

• Techniques involving graphene, carbon nanotubes (CNTs) and 2D electronics

• Thin-film silicon electronics

• Nanostructuring methods for solar cells and other devices

• Fabrication of flexible substrate systems

• Laser microstructuring, interconnects and packaging

List of Equipment

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• Mutitarget Singulus sputtering tool for magnetic multilayers (Timaris MTM)

• Multitarget confocal sputtering tool (Kenosistec)

• Metallization Singulus sputtering tool for Al, TiW(N) and Al2O3 (Timaris FTM)

• EasyTube 3000 Graphene CVD furnace system

• SPTS MPX CVD system for oxides, oxi:nitrides and a-Si:H deposition

• PECVD (800ºC) systems for CNT and carbon layers deposition tool (MicroSys 400 from Roth & Rau Microsystems)

• Thin film silicon CVD system (hotwire and radio-frequency assisted, doped and intrinsic Si layers)

• Cu Electroplating (AMMT GmbH)

_MG_2876_8• E-beam lithography tool (Vistec 5200 ES 100 kV)

• Direct write laser lithography (Heidelberg DWL 2000)

• Mask aligner (Karl Suss MA BA model)

• Optical resist track (Karls Suss Gamma Cluster)

• E-beam resist track (Karls Suss Gamma Cluster)

• Multiple ovens, including vapor priming

• Coater and hotplates for substrates up to 300 mm (SCS/EMS)

_MG_2824_8• Broad Beam ion milling with SIMS end point detect (Nordiko 7500)

• Fluorine based reactive ion etch system for oxides / nitrides (SPTS APS)

• Chlorine based reactive ion etch systems for metals (SPTS ICP)

• Silicon Deep reactive ion etching system (SPTS Pegasus)

• Plasma asher (PVA TEPLA M360)

• TMAH / KOH Si etch tanks (AMMT GmbH)

• Multiple fume hoods and wet benches for chemical processes (Quimipol)

• Oxide vapor etch release system (SPTS/PRIMAXX uEtch)

• XeF2 isotropic Si etch system (Xactic X4)

• Super critical CO2 point dryer (Tousimis)

_DSC4348_s• Chemical mechanical Planarization (Logitech ORBIS)

• Dicing saw (Disco DAD 3500)

• Wire Bonder / Aluminum Wedge, Pick and Place (TPT HB)

• Wire Bonder / Gold ball bond (TPT HB)

• CNC – High speed milling system (FlexiCAM )

• 3D printers (Makerbot and bQ WITBOX)

• Advanced desktop research printer (LP50 Roth & Rau B.V.)

• Plotter/cutter Silhouette Cameo 12″ (Fabriprint)

• Magnetic Annealer (TEL)

metrology• High resolution SEM (NanoSEM, FEI)

• Contact profilometer (KLA TENCOR P-16+)

• Resistivity mapper (AITCO)

• Optical profilometer/elipsometer (OPM hyperion with confocal sensor / Oceon Optics NanoCalc XR)

• Multiple automated wafer probers for electrical testing and others

• Manual and motorized optical microscopes for AOI

• Optical microsystem analyzer for MEMS (in-plane, out-of-plane and topography; Polytec MSA 500)

• Laser scanning vibrometer for MEMS (Polytec UHF-120, 1.2 GHz)

• Climate chamber (Weiss WKL, -70C to 180 C, 10 to 98% rel hum)

• Compact scanning bench top probe microscope (Nanosurf Flex AFM)

For more information please contact:

JoaoGasparP

Dr. João Gaspar

Head of Micro and Nanofabrication Department at INL

joao.gaspar@inl.int