Equipment

PECVD Oxides, Oxynitrides, and a-Si:H

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Description

SPTS MPX CVD - Tool dedicated to silicon oxide and silicon nitride deposition by Plasma Enhanced Chemical Vapour Deposition (PECVD). It has a single wafer processing chamber and dual high/low frequency RF options. It uses a plasma to enhance the chemical reaction rates of the precursors, which allows deposition of thin films at lower temperatures (typically<350°C) than conventional CVD systems.

Available for external use

Associated technology

Location

Cleanroom

Contact.

Joao Gaspar Contact with Joao Gaspar