Description

The electron-beam lithography system is designed for high resolution fabrication and placement of patterns written directly on substrates up to 200mm. The system is also very capable of writing optical masks for contact and projection lithography. It allows exposure of structures with minimum dimensions below 10nm, on Si and other substrates (glass, SiO2) with High current density Thermal Field Emission gun for operation at 20, 50 and 100 kV.