Atomic Layer Deposition (ALD) System

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Beneq TFS200 is a state-of-the-art atomic layer deposition (ALD) system that allows one to deposit thin films of a variety of materials such as Al2O3, TiO2, ZnO, SnO2, NiO, Co2O3, Fe2O3, CuO, ZnS and FeS, with an excellent control over film thickness. It is equipped with three liquid source lines and three hot source lines (HS300), which allow people to deposit multi-component thin films. Moreover, the fluidized bed reactor (FBR) allows one to perform deposition over powders with an average size down to 100 nanometers in a relatively large quantity (5 -50 g). The system is also equipped with a residual gas analyzer (RGA) which can be used to monitor the deposition process.

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