The PVA Tepla GIGAbatch 360M is a system designed for Photoresist ashing.
When compared to RF sources, plasma-induced damage resulting from microwave (MW) plasma processes is significantly lower making such technique more suitable and selective when ashing photoresist and other polymers. This technique also presents theoretical infinite selectivity of resist strip with respect to metals and oxides / nitrides;
This system uses Microwave (MW) plasma operating at 2.45 GHz with typical process pressure ranges from 0.6 – 1.5 mbar. It allows single and batch mode processing of 200 mm substrates (up to 25 slices).
Main applications are for photoresist ashing after dry etching processes (endpoint detection included), surface cleaning before subsequent processes and removal of organic passivation and sacrificial layers; Gases available: O2, N2, Ar, and CF4.