The Disco DAD 3350 tool is an automated dicing saw, adequate for wafers and sample parts up to 200 mm, with a maximum blade rotation of 60 krpm. It can dice Silicon wafers as well as 2.5 mm glass masks. A highly adhesive plastic UV-release tape allows secure dicing of Silicon dies down to 0.5 mm. Blade used for coarse die separation is 250 µm in width, but thinner blades of 40 µm can be used depending on the application. The software allows for programming complex sequences of distances between cuts, depth of cut, length of cut and angles. When alignment markers are present on a sample, a pattern-recognition software can be used so that the alignment and dicing can be made without human interaction.