Equipment

Wire Bonders/Pick and Place

Wirebonding_equipment Ampliar

Description

Two TPT HB 16 are available. Regular use of Gold wedge bond and ball bond (25 µm wire, sample heated at 120 °C) are possible, while Aluminum wedge bond (wire 25 µm and 17 µm, room-temperature bonding) are also available. Manual die bonder and manual pick-and-place capabilities are available. Chip carriers with row spacing 15 mm and 7.5 mm as well as flat samples can be fit onto the sample holder, fixed mechanically or using a vacuum chuck.

Available for external use

Associated technology

Location

Cleanroom

Contact.

Jérôme Borme Contact with Jérôme Borme