André joined INL in 2019 as a Research Engineer in microfabrication and integration technologies and he is currently in the Department of IP Exploitation & Knowledge Transfer, fostering connections to industry and technological partners and promoting the technical interface between those partners and the R&D groups at INL.

André Cardoso received the M.Sc. (1985, University of Aveiro) and D.Sc. (1996, Univ. of Porto) degrees in electronic engineering. He started his career at Texas Instruments Portugal, then worked in USA in R&D for semiconductor manufacturing equipment. He joined Infineon in 2003, working in the development of FPGA packaging technology and later in Package R&D in Dresden, Germany. He worked for 3 years in Thin-Film Photovoltaics R&D before joining Package Development at Nanium in 2011 (later Amkor Portugal), working on Advanced Wafer Level Packaging R&D, focusing on new technologies for 2.5D and 3D integration; MEMS integration; and System-In-Package technology. André Cardoso joined INL in 2019, working as research engineer in microfabrication and integration of MEMS and sensors. He holds 10 patents and published several papers in multiple research areas and lectures IC Packaging & Manufacturing.