SPARK-e

As electronic devices become more powerful and densely integrated, poor heat dissipation leads to overheating, compromising both efficiency and reliability. In applications where energy efficiency, compactness, and silent operation are essential—such as smart edge devices—passive thermal management is often preferred over active cooling. Traditional passive cooling methods include thermal interface materials, heat sinks, and more recently, solid-to-liquid phase change materials (PCMs). At smaller scales, solid-state thermal control devices are emerging as promising alternatives for enhanced thermal management. These materials differ from conventional passive solutions due to their sharply nonlinear thermal properties, which vary with direction and operating temperature. This unique behavior enables more efficient heat dissipation, improving circuit performance and energy conversion beyond traditional capabilities. SPARK-e will explore a selected set of solid-to-solid PCMs for: a) passive thermal management, pioneering the use of solid-to-solid PCMs; b) developing new solid-state thermal control devices, including innovative covalent organic frameworks as thermal switches; and c) energy harvesting, by using multifunctional PCMs that can store heat and convert it into electrical energy through pyroelectric effects. Experimental efforts will be supported by a simulation framework to describe how nanoscale physical properties translate into heat generation and dissipation rates within single electronic nanodevices, as well as micro and macro packages. The project will involve 10 partners from 7 EU countries, including universities, research centers, and technology suppliers, collaborating over 48 months across 12 work packages. Targeting Technology Readiness Level 4 (TRL4), SPARK-e aims to address the critical challenges of enhancing heat dissipation and reducing energy consumption in nanoelectronic devices.